December 16, 2021 10:46 AM
KUALA LUMPUR (BLOOMBERG) – Intel is spending US$7.1 billion ($9.7 billion) on new chip packaging facilities in Malaysia, a major investment to ramp up its global footprint and address a crippling global chip shortage it expects to persist until 2023. The company is earmarking more than 30 billion ringgit toward expanding its capacity in the country, chief executive Pat Gelsinger told reporters Thursday (Dec 16).
